Pan Pacific Symposium Conference Proceedings


Authors: Condia Yu, et al.
Company: Elec & Eltek and IBM Corporation
Date Published: 2/12/2009   Conference: Pan Pacific Symposium

Seika Machinery, Inc.

Abstract: The process of manufacturing printed circuit boards and printed circuit board assemblies is very complex. There are numerous process variables with all levels of interactions. These interactions can be difficult to understand and control within a printed circuit board manufacturing facility or printed circuit assembly manufacturing facility. When the interactions span facilities and companies, it takes understanding and controls to prevent latent defects from occurring downstream. What happens when a defect appears that is new, unique and different enough from the typical defect that it is not readily apparent what caused the defect and whether it was caused during the printed circuit board manufacturing process, during the assembly process or, in fact, by an interaction between the two processes?

A unique plated-through-hole solder void which did not meet IPC Class II printed circuit board Workmanship requirements as per IPC A610, Acceptability of Electronic Assemblies, occurred on a large number of assemblies.1 There are several questions which immediately arise: What caused the defect? Is the product acceptable for customer shipment? Can the defective product be reworked? Is this a seasonal defect (e.g. laminate voids caused by high levels of moisture in the laminate) or has a variable in the process shifted? A team of engineers from multiple companies worked together to answer these questions.

Key words: Solder, voids, pin-thru-hole and blowholes

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