RESOLUTION OF SOLDER VOIDS IN PIN-IN-HOLE PRODUCTAuthors: Condia Yu, et al.
Company: Elec & Eltek and IBM Corporation
Date Published: 2/12/2009 Conference: Pan Pacific Symposium
A unique plated-through-hole solder void which did not meet IPC Class II printed circuit board Workmanship requirements as per IPC A610, Acceptability of Electronic Assemblies, occurred on a large number of assemblies.1 There are several questions which immediately arise: What caused the defect? Is the product acceptable for customer shipment? Can the defective product be reworked? Is this a seasonal defect (e.g. laminate voids caused by high levels of moisture in the laminate) or has a variable in the process shifted? A team of engineers from multiple companies worked together to answer these questions.
Key words: Solder, voids, pin-thru-hole and blowholes
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.