Pan Pacific Symposium Conference Proceedings


SOCKET RELIABILITY OF HIGH-SPEED BGA PACKAGES

Authors: Yu-Jung Huang, Ming-Kun Chen, and Shen-Li Fu
Company: Department of Electronical Engineering I-Shou University
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: A test socket of high-speed ball grid array (BGA) plays a key role as a contact interface in final testing. Its life-time strongly depends on application conditions, contact types, contact materials, contact plating, housing type, housing materials, testing area environment, and setup method. Yield degradation and over rejection often happens by the increased contact resistance of signal paths, which are caused by the generation of both the particle contamination and the worn-out faults on a BGA socket. In this paper, we propose failure analysis methods for detecting socket locations causing an over rejection. Microstructural characterization of wear-out pin was observed by scanning electron microscope (SEM), equipped with an energy dispersive X-ray (EDX) under service condition. The results obtained in this study is conducted to determine practical problems with the procedure and to find solutions, which can be employed at the IC testing industry.

Key words: ball grid array (BGA), socket, energy dispersive X-ray (EDX)



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