Pan Pacific Symposium Conference Proceedings


IMPLEMENTATION OF 01005s: A CASE STUDY

Authors: Paul N. Houston, Gary L. Turpin, and Daniel F. Baldwin, Ph.D.
Company: Engent Inc. – Enabling Next Generation Technologies
Date Published: 2/12/2009   Conference: Pan Pacific Symposium


Abstract: Passive components continue to get smaller as space and weight constraints on modules continues the push for smaller and lighter components. 0402 size components have been in high volume production for many years and 0201s are being run in high volumes by a number of companies. The next size step down for passive components is 01005s which are less than 45% the size of a 0201 and 16% of the size of a 0402. This paper presents a production part implementation case study for 01005 passive components including a review of some process challenges that were encountered, rework of 01005 components, and highlights in design for manufacturability. From the process perspective, implementation challenges for 01005 components were mainly the print process and the placement process. The main challenge of the print process was getting a consistent amount of solder paste through the extremely small apertures used for the 01005 components. Some of the issues with the placement process included the pick up reliability, visioning, and placement accuracy. The reflow process that was previously established for 0201 components yielded very similar results during the implementation of the 01005s. Rework of the 01005 passives presented another unique opportunity for process improvements. From a design for manufacturability perspective, pad design and pad to pad spacing had a significant influence on first pass yields.

Key words: Passive components, assembly, processing, 01005



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