IWLPC (Wafer-Level Packaging) Conference Proceedings


Authors: Carl Ryu, et al.
Company: Tessera
Date Published: 10/13/2008   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Consumer’s expectation for greater and greater functionality in mobile electronic devices is placing increasing pressure to continuously improve functionality and portability on design and hardware platforms. To meet these requirements, designers are expected to deliver devices ever more densely integrated with physically thinner profiles while maintaining enhanced thermal and electrical functionality. Additionally, the devices must meet mandatorily reliability expectations, such as drop test and thermal cycling conditions. This presentation discusses a novel embedded package substrate structure designed to address these issues and reviews the results of reliability simulations and experiments.

Keywords: Embedded Substrate, µPILR technology

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