INNOVATIVE FRONT TO BACK ALIGNMENT TECHNOLOGY FOR MEETING 3D PACKAGING REQUIREMENTS OF LEADING EDGE CONSUMER PRODUCTSAuthors: Manish Ranjan, Emily True, and Andrew M. Hawryluk
Company: Ultratech Inc.
Date Published: 10/13/2008 Conference: IWLPC (Wafer-Level Packaging)
An innovative front to back alignment technology utilizing front side IR (infra red) approach for the dual side alignment process step is developed. The use of this approach allows customers with flexibility regarding target placement location. This feature is designed to achieve front-to-back overlay of less than 2 µm (mean + 3s) over a full 300 mm wafer. The primary development concept decisions concentrated on illumination wavelength, illumination source type, image sensor type, and optical design.
It is anticipated that the dual side alignment feature will be a key technology enabler for customers requiring through silicon via for 3D packaging and system in package applications.
Key Words: Through Silicon Via, Dual-side alignment, back-to-front alignment, system in package, wafer level packaging
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