TSV THINNED WAFER DEBONDING PROCESS OPTIMIZATIONAuthors: Mark Privett, et al.
Company: Brewer Science Incorporated and EV Group
Date Published: 10/13/2008 Conference: IWLPC (Wafer-Level Packaging)
Several temporary bonding schemes have been proposed and tested, each with it’s particular properties and advantages. One approach for temporary bonding, is based on a wafer by wafer bonding and debonding process by using thermoplastic polymeric-based spin-on material as temporary agent in the bond-interface. In this, single wafer processing approach, thinned wafer debonding requires careful process setup and optimization enabling the highest throughput and equipment utilization. For this work, researchers have teamed up to carefully set-up and analyze the slide debond process and define machine and materials physical requirements. The debond process is modeled using engineering analysis and empirical testing is used to confirm the model quality.
The paper will provide an overall introduction on the temporary bonding and debonding scheme, enabling processing of thin and ultra-thin wafers utilizing existing equipment and process platform. The bonding and debonding technology using Brewer Science HT-materials as intermediate layers and EVG’s equipment platform are described in more detail. Extensive discussion of the thermally activated slide-off debond-process including mathematical modeling of material and process properties will conclude the paper.
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