COST REDUCTION OF WAFER LEVEL PACKAGING BY USING ESTABLISHED MATERIALS FROM NON-ELECTRONICS INDUSTRIESAuthor: Giles Humpston
Date Published: 10/13/2008 Conference: IWLPC (Wafer-Level Packaging)
This paper will present a new wafer-level chip size package that comfortably exceeds mobile phone and automotive reliability standards. In this technology the image sensor is protected from contamination using a cover glass from the initial stage of processing. The electrical contacts on the front face of the silicon are connected to a ball grid array on the rear surface of the package, making it suitable for standard surface mount assembly. The final package thickness is approximately half that of the original silicon wafer. A key element of the package is that it is fabricated using a material produced in extremely high tonnage for an entirely different industry and purpose and therefore, is significantly cheaper than anything comparable made specifically for semiconductor applications.
Keywords: Wafer-level chip size package (WLCSP), image sensor, electrophoretic material
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