APPLICATION OF Ni/Pd/Au SURFACE FINISHED SUBSTRATE FOR CHIP-SCALE PACKAGING AND ITS DROP TEST PERFORMANCEAuthors: Geun Sik Kim, et al.
Company: STATS ChipPAC Inc.
Date Published: 10/13/2008 Conference: IWLPC (Wafer-Level Packaging)
Laminate chip scale package (VFBGA, 11mmx11mm, 432L) with electroless nickel/ electroless palladium / immersion gold surface finished substrate is studied for its assembly performances by comparing with standard electrolytic Ni/Au surface finished substrate. One is wire bonding evaluation to find optimal layer thickness of Ni/Pd/Au surfaces and its bondability. Another is solder ball attach process and its board level reliability performance by testing its solder ball attach integrity and drop test reliability. Ni/Pd/Au surface finished substrate shows comparable performances in both wire bondability and drop test reliability compared with substrates with standard electrolytic Ni/Au surface.
Keywords: Electroless nickel / electroless palladium / immersion gold, FBGA, Drop performance
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