Laminate chip scale package (VFBGA, 11mmx11mm, 432L) with electroless nickel/ electroless palladium / immersion gold surface finished substrate is studied for its assembly performances by comparing with standard electrolytic Ni/Au surface finished substrate. One is wire bonding evaluation to find optimal layer thickness of Ni/Pd/Au surfaces and its bondability. Another is solder ball attach process and its board level reliability performance by testing its solder ball attach integrity and drop test reliability. Ni/Pd/Au surface finished substrate shows comparable performances in both wire bondability and drop test reliability compared with substrates with standard electrolytic Ni/Au surface.

Keywords: Electroless nickel / electroless palladium / immersion gold, FBGA, Drop performance">

IWLPC (Wafer-Level Packaging) Conference Proceedings


APPLICATION OF Ni/Pd/Au SURFACE FINISHED SUBSTRATE FOR CHIP-SCALE PACKAGING AND ITS DROP TEST PERFORMANCE

Authors: Geun Sik Kim, et al.
Company: STATS ChipPAC Inc.
Date Published: 10/13/2008   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The electroless nickel/ electroless palladium / immersion gold (Ni/Pd/Au) surface finished substrate for a "No Plating Line(NPL)" design has relatively shorter manufacturing process steps compared with that of traditional bussless technology such as NPL or etch-back finished substrate. It also reduces material usage of Au. Both simpler manufacturing process steps and less usage of Au can reduce the cost of substrates. By applying electroless Ni/Pd/Au surfaces to the wire bond pad and solder ball pad of package substrates, we can achieve design flexibility for I/O routing with low substrate cost and meet industry trend for more integration and miniaturization.

Laminate chip scale package (VFBGA, 11mmx11mm, 432L) with electroless nickel/ electroless palladium / immersion gold surface finished substrate is studied for its assembly performances by comparing with standard electrolytic Ni/Au surface finished substrate. One is wire bonding evaluation to find optimal layer thickness of Ni/Pd/Au surfaces and its bondability. Another is solder ball attach process and its board level reliability performance by testing its solder ball attach integrity and drop test reliability. Ni/Pd/Au surface finished substrate shows comparable performances in both wire bondability and drop test reliability compared with substrates with standard electrolytic Ni/Au surface.

Keywords: Electroless nickel / electroless palladium / immersion gold, FBGA, Drop performance



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