Surface Mount International Conference Proceedings


ASSEMBLY LINE DEFINITION FOR FLEXIBLE BGA PACKAGE MANUFACTURING

Author: Philip Momin
Company: AMTI, Zevatech Group
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: Growing demand exists for lower-cost BGA device packaging. In order to achieve this requirement, while maintaining product quality and performance, there will be an evolutional blending of BGA material selection, process recipes, and equipment capabilities. A major contributing factor in these pursuits will be the inherent ability of the selected assembly equipment to support the various evolving assembly options in a low-cost, low-risk manner.



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