IWLPC (Wafer-Level Packaging) Conference Proceedings


Authors: Mike Bixenman, DBA and Steve Stach
Company: Kyzen Corporation and Austin American Corporation
Date Published: 10/13/2008   Conference: IWLPC (Wafer-Level Packaging)

Abstract: High volume flip chip and other micro-array packaging designs can present significant production cleaning challenges. The density of the package I/O structure leaves little space for cleaning. These factors render most cleaning systems incapable of thoroughly cleaning post soldering residues. New approaches are needed to provide a reliable high volume method of cleaning micro-array IC packages. This work benefits customers who remove flux residue to improve capillary underfill, adhesion, and reduced voiding.

Inline cleaning machines utilizing aqueous engineered cleaning fluids represent the process of choice for cleaning high I/O flip-chip assemblies. As the bump pitch becomes tighter, standard inline cleaner designs have not been able to clean adequately under array packages because of the reduced geometries. Bigger pumps and higher pressures are the obvious solution, but create their own set of problems like parts damage and material handling. The designed experiment will test the use of vectored jets to allow a higher differential pressure across the IC. The research hypothesis infers that vectored jets will improve fluid penetration resulting in higher throughput. A transparent flip chip mock-up will be utilized to provide visual understanding of cleaning differences. Standard no-clean low residue and water soluble flux joining materials will be evaluated.

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