SMTA International Conference Proceedings


Author: Kerem Durdag
Company: Conceptronic
Date Published: 9/12/1999   Conference: SMTA International

Abstract: As components become smaller, component mixes become more diverse, and board densities continue to increase, the processes of packaging, interconnection, and assembly are challenging the capabilities of existing production equipment. Contributing to the difficulties for design and development engineers are such considerations as operating costs, throughput, and the environment. For reflow soldering ovens, the particular challenges are those of achieving the correct thermal profile, optimum heat transfer and cooling, and effective removal of airborne flux… all of which impact yields and mandate total management of the flow of gases within the oven.

A process called Dynamic Flow Engineering technology, or DFE, is an approach being taken to ensure the effective management of process gases in reflow ovens.1

Dynamic Flow Engineering is both a concept and a process engineering approach to oven design for analyzing and managing the flow of gases through the oven. The result is precise control over the thermal process, removal of flux in both the heating and cooling sections, and outstanding quality and reliability during reflow. This paper examines particular design features implemented to optimize the reflow process through the treatment and directing of the flow of process gases in ovens featuring DFE Technology.

Certainly, other factors play an essential role in oven performance as well, including the operating software and even the conveyor and board support systems. No aspect of oven design, however, is more critical to the forming of acceptable solder joints than the flow of oven gases that transfer energy to uniformly heat and cool the product. Effectively controlling the heat transfer through the temperature and flow of gas molecules allows the surfaces being joined to wet properly and form a strong metallurgical bond, while at the same time, the volatized flux is carried away and removed from the heat tunnel (internal heating chamber).

Key words: flux management, reflow soldering, thermal profiling

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