SMTA China Conference Proceedings

Is it Really Impossible? Combining Superior Anti-Oxidation and Superior Print

Author: Dr. Ning-Cheng Lee
Company: Indium Corporation of America
Date Published: 4/8/2008   Conference: SMTA China

Abstract: Miniaturization results in excessive oxidation for reflow soldering applications. Approaches for enhancing the oxidation barrier restricts the potential for improvement due to the difficulty of concurrent solder paste deposition. A new lead-free no-clean paste Indium 8.9ATG has been developed, which provides both superior anti-oxidation and printing performance. The flux technology developed also brings in other improvement such as low voiding.

Key Words: solder paste, flux, oxidation, graping, print, SMT, reflow, solder, soldering, voiding, SIR

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