HALOGEN-FREE DEBATE ON SOLDERPASTE: IPC CLASSIFICATION AND APPLICATION (CHINESE)
Authors: Christine Poon, Audrey Long, James Wang Company: Kester Components Pte Ltd Date Published: 4/8/2008
Abstract: Halogen-free requirement1 in PCBA and in related materials has been gaining momentum in recent months. Major computer manufacturers had made announcements about intentions to go bromine-free in the next two years. Halogen-free started from RoHS banned substances on PBB4 and PBDE5 initially, however, it has evolved to a broader coverage of detectable halogen level per IEC 61249-2-216, JPCA-ES-01-20037, and IPC-4101B8 specifications. Currently, solderpaste formulation is classified by IPC J-STD-004A9 standard, with permissible and declared halogen/halide level. This paper compares and contrasts the current IPC, J-STD-004A standard and the impact of halogen-free requirements on the classification. A study is also done to examine whether solderability of halogen-free solderpaste formulas is lowered versus halogenated formulas.