SMTA China Conference Proceedings


HALOGEN-FREE DEBATE ON SOLDERPASTE: IPC CLASSIFICATION AND APPLICATION

Authors: Christine Poon, Audrey Long, James Wang
Company: Kester Components Pte Ltd
Date Published: 4/8/2008   Conference: SMTA China


Abstract: Halogen-free requirement1 in PCBA and in related materials has been gaining momentum in recent months. Major computer manufacturers had made announcements about intentions to go bromine-free in the next two years. Halogen-free started from RoHS banned substances on PBB4 and PBDE5 initially, however, it has evolved to a broader coverage of detectable halogen level per IEC 61249-2-216, JPCA-ES-01-20037, and IPC-4101B8 specifications. Currently, solderpaste formulation is classified by IPC J-STD-004A9 standard, with permissible and declared halogen/halide level. This paper compares and contrasts the current IPC, J-STD-004A standard and the impact of halogen-free requirements on the classification. A study is also done to examine whether solderability of halogen-free solderpaste formulas is lowered versus halogenated formulas.

Key Words: halogen-free, solderpaste



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