The Study of Mini-wave Soldering Process in Lead Free Assembly (CHINESE)Authors: Harvey Chang, Jay Huang, J.L. Ku, Ander Hsieh, Andrew Lee
Company: Wistron Corporation
Date Published: 4/22/2007 Conference: SMTA China
This research characterizes the preheat of PCB through a batch process to decrease the dwell time required for the PCB to be in contact with molten solder during mini-wave process. This helps to reduce the copper dissolution. Secondly, the effects of fluxing scenario and flux materials are explored to ensure the desired hole-fill ratio can be achieved. Finally, process parameters such as solder contact, dwell time, preheat temperature are investigated through Taguchi based experimental design. Performance of hole-fill is obtained through the 2.5D and 5D X-ray analysis. The influence on copper dissolution is then determined by cross-sectioning followed by SEM measurement. The induced board warp distortion is also characterized. The statistical results help to establish operational procedures that can be used for mini-wave soldering process concurrently satisfying several critical response variables. Key words: mini wave soldering, PTH hole fill, copper dissolution, thermal relief.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.