Optimising Rheology for Package-on-Package Flux Dip Processes (CHINESE)
Authors: Steve Brown, Chrys Shea, et al. Company: ALPHA – A Cookson Electronics Company Date Published: 4/22/2007
Abstract: The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of the newest advances in recent years is for semiconductors to be stacked, one on top of the other, in a single package. This die stacking allows system designers to take advantage of the often more readily available “Z” axis of the cubic area while saving on the valuable “X” and “Y” square dimensional space on PCB layouts.