Medical Electronics Symposium Conference Proceedings


Authors: Brian Toleno, Ph.D. and Jeff Bowin
Company: Henkel Corporation
Date Published: 1/31/2008   Conference: Medical Electronics Symposium

Abstract: Medical devices require a greater degree of functionality in smaller spaces. While this is similar to the trends in mobile phone devices, there is a significant difference in the reliability required between these types of systems [1]. For many years underfill materials that have been used to increase the reliability of flip-chip devices in packages and on SMT boards. These materials are now being used more often to increase the reliability of surface mount devices such as chip scale packages (CSPs) and ball grid arrays (BGAs). This presentation will discuss the significant differences between the critical physical properties of flip-chip underfill versus board-level underfill, and how these properties affect the reliability of the underfilled device. In addition there exist several different “classes” of adhesives beyond the classic capillary flow materials, such as cornerbond or edgebond materials and encapsulants. In this paper we will discuss the differences between these approaches and their affect on the reliability of the electronics devices they are designed to enhance.

Key words: Adhesives, Reliability, Underfill

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