MANUFACTURING MINIATURIZED MEDICAL DEVICES AND SENSORSAuthor: Donald Styblo
Company: Valtronic Technologies (USA) Inc.
Date Published: 1/31/2008 Conference: Medical Electronics Symposium
Listed below are some of the assembly technologies that will be addressed in the paper and presentation as utilized in Manufacturing Miniaturized Medical Devices and Sensors.
The presentation will conclude with examples of nanotechnology and optical devices, high-powered advanced-light-emitting-diode (LED) Projects. It will also briefly explore manufacturing optoelectronics, semiconductors, and MEMS devices, with a focus on Metal Organic Chemical Vapor Deposition (MOCVD) materials to include combinations of InAs, GaAs, GaAlAs, GaAllnP, InP, InGaAs InGaAlP and InGaAlAs. Utilizing this MOCVD process the team has developed the Advanced-Thermal Photo Voltaic (A-TPV)1 Quantum Wells and Quantum Dots power converter devices. This MOCVD process was also utilized to develop a High Powered advanced LEDs at an infrared frequency of >1600nm.
Keywords: Chip on board, electronic miniaturization, flip chip, medical devices, sensors.
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