Medical Electronics Symposium Conference Proceedings


Authors: Peter Borgesen, et al.
Company: Unovis Solutions and Binghamton University
Date Published: 1/31/2008   Conference: Medical Electronics Symposium

Abstract: Medical applications share interconnect technologies and associated damage mechanisms with the other, larger volume, sectors of the microelectronics industry. However, the loading conditions may be different and the reliability requirements very often are. Notably, medical microelectronics products include some for which even the perception of a risk is not acceptable. This poses a problem when applying ‘common industry practices’ and standards to reliability optimization and assessment. The present work outlines our current understanding of problems and risks associated with the most common second level interconnect: the solder joint. These include damage to the solder itself as well as to the intermetallic bonds to the pads and to the substrates underneath.

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