SURFACE MOUNT ASSEMBLY CHALLENGES FOR HIGH DENSITY POP (PACKAGE-ON-PACKAGE) UTILIZING SOP (SOLDER-ON-PAD) TECHNOLOGYAuthors: Joanna Kristine Wildhart and Moody Dreiza
Company: Panasonic Factory Solutions Company of America and Amkor Technology Inc.
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
This paper will analyze several material and process conditions for SOP PoP assembly. First the assembly process and test vehicle will be described. Next, the optimized parameters for placement of the top package will be explained. Three different stacking materials (standard PoP flux, standard PoP dipping PasteA and SOP PoP specific dipping PasteB) and three reflow profiles (standard, longer warm-up time and increased peak temperature) will be analyzed in detail. The parts from each leg will be inspected through visual inspection and x-ray analysis for failure analysis. Joint integrity will then be studied by cross-section with SEM inspection and dye-pry analysis. Finally, stand-off height will be measured. The best material and process conditions will be determined based on final yield and also by considering stand-off height. This paper will show that stacking material and, to a lesser degree, reflow profile have a significant effect on the stacking yields.
Key words: PoP, package-on-package, ball grid array, solder on pad
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