Pan Pacific Symposium Conference Proceedings


Author: Henry H. Utsunomiya
Company: Interconnection Technologies, Inc.
Date Published: 1/24/2008   Conference: Pan Pacific Symposium

Abstract: Japanese packaging substrate manufacturers are still dominant in the worldwide market not only for high performance and cost performance applications but also stacked memory applications. Since increasing signal processing speed and decreasing operating voltage, packaging substrate requires higher density of circuits with thinner materials to assure signal integrity. It is quite difficult challenges not only for packaging substrate manufacturers but also materials suppliers to assure required electrical performance together with mechanical strength and thermal management. And it is approaching to limitation of current organic substrate technologies.

On the other hand, packaging substrates are stepped into next generation, so called “embedded active devices and passive devices.” Since the digital portable electronics products such as cellular phones, digital video camcorders, digital still cameras and other portable AV products required more function into lighter, smaller and thinner form factor with higher signal processing speeds. The System in Packages (SiP) and/or module boards with embedded active devices are already in volume production in Japan mostly for cellular phone applications. And it is expected to expand to cellular phone motherboards in the very near future.

Key words: packaging substrate, embedded active devices, embedded passive devices, buildup

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