PACKAGING SUBSTRATE TECHNOLOGIES TREND IN JAPANAuthor: Henry H. Utsunomiya
Company: Interconnection Technologies, Inc.
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
On the other hand, packaging substrates are stepped into next generation, so called “embedded active devices and passive devices.” Since the digital portable electronics products such as cellular phones, digital video camcorders, digital still cameras and other portable AV products required more function into lighter, smaller and thinner form factor with higher signal processing speeds. The System in Packages (SiP) and/or module boards with embedded active devices are already in volume production in Japan mostly for cellular phone applications. And it is expected to expand to cellular phone motherboards in the very near future.
Key words: packaging substrate, embedded active devices, embedded passive devices, buildup
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