PROCESS AND ASSEMBLY METHODS FOR INCREASED YIELD OF PACKAGE ON PACKAGE DEVICESAuthors: Brian Toleno, Ph.D. and Dan Maslyk
Company: Henkel Corporation
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
In this paper we compare the process conditions and yield achieved when assembling package on package devices utilizing different materials and methodologies. In all cases the devices were Pb-free devices with solder paste used for the bottom package. The material and process and materials were varied for the top package. The materials used for the top package assembly included tacky flux, solder paste, and an epoxy flux system. Once assembled the devices were tested for electrical yield, solder joint metallurgy integrity, and standoff height.
Key words: Package on Package, PoP, SMT Assembly
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