Surface Mount International Conference Proceedings


Author: Helmut Kergel
Company: VDI/VDE
Date Published: 9/10/1996   Conference: Surface Mount International

Abstract: During the production of high-value electronic boards it is often necessary to exchange BGAs within a repair process. The boards are mostly complex and expensive multilayers. Different kinds of soldering techniques are used, e. g. hot gas is a common method. The experience with the repair of BGA boards has shown that the control of the temperature cycles for resoldering and soldering is a key issue. A new method to control the temperature of the hot gas is going to be introduced: The main patented idea is to control the temperature of the gas by mixing a hot and cold gas stream instead of heating up and cooling down one single gas stream. Another important point to be discussed is the construction of the vacuum nozzles for the handling of the BGAs. It has to be adapted depending on the kind of balls (“hard” or “soft” balls), the surrounding of the soldering area has to be protected from the heat, the gas stream has to be regulated in a way that the soldering area is heated up uniformly and the use of special gas atmospheres should be possible. Especially with the application of µBGA and flip chip devices on PC-boards becoming more familiar, a vision alignment system and an exact placement process is required. Keywords BGA, rework, repair, board assembly, hot-gas soldering

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