Pan Pacific Symposium Conference Proceedings


Author: Vern Solberg
Company: Tessera, Inc.
Date Published: 1/24/2008   Conference: Pan Pacific Symposium

Abstract: The motivation for developing higher density IC packaging continues to be the portable handset and personal entertainment market. The consumers’ expectation is that each new generation of products exhibit expanded functionality while maintaining a relatively small form factor. To meet this challenge, a number of unique high density IC package innovations have evolved and many of these packages have proved ideal for a growing number of consumer electronic applications. A number of 3D Packageon-Package configurations have already been integrated into the high-volume electronic market and some are even furnishing improved performance capability for larger highend commercial servers and computing systems. The challenge electronic manufactures face when competing in the world marketplace is to offer a product that will meet all physical demands and performance expectations without increasing the end products size or cost.

The material developed for this paper reviews potential market segments for 3D packaging and outlines current expectations for multiple-function IC packaging for a number of electronic applications. Package stacking has considerable advantage over die-stack packaging because each section can be pre-tested before joining. This pre-test capability greatly improves the overall manufacturing yield and functionality of the final package assembly is assured. A key advantage of the µPILR package-on-package configuration is that each layer of the package is significantly thinner than other ball-stack package methodologies. Information furnished will focus on the products development, performance criteria and, in particular, the stringent qualification test performed specifically for the vertically configured µPILR package technology.

Key words: µPILR, CSP, PoP

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