µPILR™ PACKAGE PLATFORM- A HIGHER DENSITY PACKAGE-ONPACKAGE INNOVATION FOR NEXT GENERATION ELECTRONICSAuthor: Vern Solberg
Company: Tessera, Inc.
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
The material developed for this paper reviews potential market segments for 3D packaging and outlines current expectations for multiple-function IC packaging for a number of electronic applications. Package stacking has considerable advantage over die-stack packaging because each section can be pre-tested before joining. This pre-test capability greatly improves the overall manufacturing yield and functionality of the final package assembly is assured. A key advantage of the µPILR package-on-package configuration is that each layer of the package is significantly thinner than other ball-stack package methodologies. Information furnished will focus on the products development, performance criteria and, in particular, the stringent qualification test performed specifically for the vertically configured µPILR package technology.
Key words: µPILR, CSP, PoP
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