Pan Pacific Symposium Conference Proceedings


COST EFFECTIVE COPPER TSV INTERCONNECT INTEGRATION

Author: Paul Siblerud
Company: Semitool Inc.
Date Published: 1/24/2008   Conference: Pan Pacific Symposium


Abstract: The development of IC technology is driven by the need to increase performance and functionality while reducing size, power and cost. The continuous pressure to meet those requirements has created innovative, small, cost-effective 3-D packaging technologies. General advantages of 3-D packaging include the miniaturization of size and weight, the integration of heterogeneous technologies in a single package, the replacement of long 2-D interconnects with short vertical interconnects, and the reduction of parasitics and power consumption. Therefore, 3-D packaging can offer significant advantages in performance, functionality and form factor for future technologies.



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