Pan Pacific Symposium Conference Proceedings


Authors: Chrys Shea and Prashant Chouta, et al.
Company: Jabil Circuit, VI Technology, and Cookson Electronics
Date Published: 1/24/2008   Conference: Pan Pacific Symposium

Abstract: Tombstoning, the phenomena where a chip component stands up on one end during the reflow cycle, is welldocumented and understood in tin-lead systems. It is reported to occur more frequently in lead-free systems, and smaller components are at greater risk than larger ones.

A comprehensive DOE was undertaken to characterize tombstoning of 0201 components in different metallurgical solder systems. Factors included pad geometry, board finish, stencil geometry, solder paste type, print and placement offsets, and reflow profile and atmosphere. The experiment was divided into two phases; the results of Phase 1 are analyzed and reviewed.

Key words: Lead-free, miniaturization, tombstoning, reflow, 0201 components

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