THE INFLUENCE OF THE PWB FABRICATION ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERINGAuthors: Chrys Shea and Jim Kenny, et al.
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
A series of studies have been developed to gauge the effect of copper erosion on PWBs when exposed to various combinations of time, temperature and alloy in both standard and selective soldering processes. The study was broken in to phases, the first of which aimed to isolate the influence of the copper’s manufacturing process on its likelihood to erode during subsequent soldering processes. The results of phase 1, using SAC305 solder alloy, are presented.
Key words: Lead-free, wave soldering, copper erosion, copper dissolution
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