Pan Pacific Symposium Conference Proceedings


DEVELOPMENT STATUS OF AN OCCAM ELECTRONIC ASSEMBLY METHOD

Authors: Edward S. Binkley, Ph. D. and Richard F. Otte
Company: PROMEX INDUSTRIES INC.
Date Published: 1/24/2008   Conference: Pan Pacific Symposium


Abstract: The Occam assembly concept is under development as a low cost, solderless assembly method. This version of the process utilizes a “sticky” surface to hold conventional SMT parts in place until they can be covered with an encapsulant, restrained by a containment frame, that will permanently hold them in place with respect to one another. The encapsulant is added to cavities formed by the containment frame, and then cured to lock the parts in place. The assembly is then removed from the sticky surface thereby exposing the electrical contact points, inverted, and interconnects made between the electrical contact points utilizing screen printing or other suitable methods. The interconnect structure is then overcoated to protect it. The individual parts are removed from the containment fixture in the last step before test and shipment. Several variations of the process are presented. In general, the process eliminates the use of solder and related processes and does not expose components to temperatures greater than ~100C. In some applications, the process produces a “final” part ready for shipment to the end user by eliminating a case or additional enclosure. Finally, some preliminary economics of the process are presented suggesting applications where the process offers the greatest advantage.

Key words; Solderless Assembly, OCCAM, SMT assembly, electronic assembly



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