MARKET DRIVERS AND COST ANALYSIS FOR 3D TSVAuthors: Eric Mounier, Ph.D., Jérôme Baron, and Jean-Christophe Eloy
Company: Yole Développement
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
Moreover, there are numerous market drivers for TSVs, depending upon the final applications. We will review them in this article. We have also developed an internal tool which can be used for semiconductor wafer cost calculations. We used it for cost modeling for TSV and this article shows our results.
Key words: TSV, COO, 3D packaging
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