SMTA International Conference Proceedings


ENHANCING BOARD LEVEL BGA ASSEMBLY AND RELIABILITY

Author: Steven Dunford
Company: Raytheon Systems
Date Published: 9/12/1999   Conference: SMTA International


Abstract: Expectations for circuit card assembly yields with area array packages are five to six sigma with relatively little effort. These simplistic expectations do not reveal the true complexity of processing BGAs, CSPs, mBGAs, and other Area Array Packages for high reliability applications. High assembly yields are very achievable if attention is paid to seemingly unnecessary details. Overlooking them can result in disappointing yields, potentially disastrous rework costs, and lower solder joint reliability. In this paper are presented discussions of board design, assembly component mix, equipment capabilities, handling, and BGA rework. Examples of actual defects encountered on the assembly line are provided along with suggestions for successful assembly of area array packages for high reliability.

Keywords: Area array packages, BGA, CSP, Package issues, Board issues, Assembly Process, Voids, Quality, Reliability



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819