SMTA International Conference Proceedings


Author: Steven Dunford
Company: Raytheon Systems
Date Published: 9/12/1999   Conference: SMTA International

Abstract: Expectations for circuit card assembly yields with area array packages are five to six sigma with relatively little effort. These simplistic expectations do not reveal the true complexity of processing BGAs, CSPs, mBGAs, and other Area Array Packages for high reliability applications. High assembly yields are very achievable if attention is paid to seemingly unnecessary details. Overlooking them can result in disappointing yields, potentially disastrous rework costs, and lower solder joint reliability. In this paper are presented discussions of board design, assembly component mix, equipment capabilities, handling, and BGA rework. Examples of actual defects encountered on the assembly line are provided along with suggestions for successful assembly of area array packages for high reliability.

Keywords: Area array packages, BGA, CSP, Package issues, Board issues, Assembly Process, Voids, Quality, Reliability

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