MANAGING ELECTRONICS MANUFACTURING BUSINESS IN CHINAAuthors: Wei Koh, Ph. D.
Company: Pacrim Technologies, Inc
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
This paper provides some insights in discussing the major issues facing current electronics manufacturing business in China. First part is a quick review of the progress in semiconductor front end and backend assembly, as well as electronics assembly in China--including a list of major firms moving backend packaging manufacturing to China in 2007. A section then is given on risks and challenge assessment in China today. The key factors to be considered facing a small entrepreneur entering the market in China in three stages are discussed—the startup, sustaining, and closure phases. Finally, in the concluding remarks, the outlook for the competitive landscape of electronics manufacturing in China for the immediate future is summarized.
Key words: Manufacturing, China, management
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