Pan Pacific Symposium Conference Proceedings


Authors: Bill Rugg, Radesh Jewram and Sanjay Misra
Company: Seagate Technology and The Bergquist Company
Date Published: 1/24/2008   Conference: Pan Pacific Symposium

Abstract: An ongoing demand for smaller form factors and increased data transfer rates has severely constrained the packaging of disc drive electronics. Integration of more system level functions on packaged silicon has driven the disc drive industry toward thinner/smaller printed wiring board assemblies and created thermal bottlenecks on ASICS. Usage of silicon-free, thermally conductive and disc drive compliant interface materials, which couple the heat generated to the HDD case, can alleviate these bottlenecks. The use of thermally conductive materials can significantly reduce chip temperatures leading to both (A) more reliable and faster data transfer rates, and (B) long term silicon reliability. In this paper we illustrate thermal enhancements on select disk drive packages and identify key materials properties necessary to achieve these results. Thermally conductive materials within ranges from 1-3 W-m-1 - K-1 were examined and led to temperature reduction of 10-15 degrees C in select cases.

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