SOLDERLESS ASSEMBLY AND INTERCONNECTION OF ELECTRONIC PACKAGESAuthor: Joseph Fjelstad
Company: Verdant Electronics
Date Published: 1/24/2008 Conference: Pan Pacific Symposium
In this hostile new assembly environment, a new solderless approach to manufacturing circuits directly onto the assembled components has been devised and is in the process of development by a growing number of forward looking companies from around the globe. This article will describe in detail the process, which has come to be commonly known as the Occam Process named to honor the 14th century English philosopher and logician, William of Occam, whose rigorous thinking and arguments favored and encouraged the finding the simplest possible solution to every problem.
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