RELIABILITY ASSESSEMENT OF EMBEDDED CHIP BUILD-UP BGA PACKAGES – Part II
Authors: Charles G. Woychik, Ph.D., Raymond A. Fillion, Tan Zhang, Paul McConnelee, and Shane M. Lewis Company: GE Global Research Date Published: 10/11/2007
Abstract: The Embedded Chip Build-Up (ECBU) packaging technology is able to meet the aggressive performance; reliability and package assembly yield challenges for the next generation of high-end semiconductor devices. This paper presents an overview of the second phase of testing ECBU packages and compares the performance benefits of ECBU technology verses the existing commercial high performance flip chip solder attach on high density organic chip carriers. In this paper, reliability data is presented for the advanced Cu/Low-K advanced semiconductors. The effect of surface defects on the semiconductor and the impact it has on the final reliability will be presented. Different materials have also been investigated in order to improve the adhesion at the critical interfaces; such as the stiffener to build-up and die to build-up interface.
Key words: Embedded chip build-up, BGA, high performance packaging