SMTA International Conference Proceedings


RELIABILITY ASSESSEMENT OF EMBEDDED CHIP BUILD-UP BGA PACKAGES – Part II

Authors: Charles G. Woychik, Ph.D., Raymond A. Fillion, Tan Zhang, Paul McConnelee, and Shane M. Lewis
Company: GE Global Research
Date Published: 10/11/2007   Conference: SMTA International


Abstract: The Embedded Chip Build-Up (ECBU) packaging technology is able to meet the aggressive performance; reliability and package assembly yield challenges for the next generation of high-end semiconductor devices. This paper presents an overview of the second phase of testing ECBU packages and compares the performance benefits of ECBU technology verses the existing commercial high performance flip chip solder attach on high density organic chip carriers. In this paper, reliability data is presented for the advanced Cu/Low-K advanced semiconductors. The effect of surface defects on the semiconductor and the impact it has on the final reliability will be presented. Different materials have also been investigated in order to improve the adhesion at the critical interfaces; such as the stiffener to build-up and die to build-up interface.

Key words: Embedded chip build-up, BGA, high performance packaging



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