FLUX SELECTION FOR LEAD-FREE WAVE SOLDERINGAuthors: Douglas Watson, Jasbir Bath, Pan Wei Chi
Company: Solectron Corporation
Date Published: 10/11/2007 Conference: SMTA International
The design of experiment varied topside board preheat and conveyor speed. The solder qualities evaluated included vertical barrel fill, solder bridges, bottom side wave soldered surface mount device solder skips, and solder balls. General conclusions were drawn from statistical analysis of the solder quality to correlate improved results with optimum preheat, conveyor speed and, by correlation, solder contact time. This helped to clarify the different limits of liquid flux types used for lead-free SnAgCu wave soldering compared with tin-lead wave soldering, with gaps identified for future work by wave flux suppliers and board designers.
Key words: Flux, Pb-free, wave solder
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.