Authors: Harald Wack, Ph.D., Umut Tosun, Naveen Ravindran, Joachim Becht, Ph.D., Helmut Schweigart, Ph.D., and Dirk Ellis Company: ZESTRON America, ZESTRON Europe, and Speedline Technologies Date Published: 10/11/2007
Abstract: The associated increase in the complexity of components in the electronics industry results in a continuous decrease in stand off spacing between the components and the substrate’s surface. At the same time, the requirements for the product reliability and life expectation are continuously increasing, especially in the case of RF Technology.iThis in turn makes cleaning mandatory and the question arises as to which cleaning process can provide the required cleanliness levels under narrow capillary spaces. Furthermore, the contacts that are present under BGAs, micro-BGAs or CSPs pose additional mechanical barriers. As a result the capillary penetration of the cleaning and rinsing agent is hampered. A suitable cleaning process should not only allow the cleaning media ample access to capillary spaces, but it also has to remove contamination and discourage re-contamination. New innovative approaches are now being introduced to further address this increase in cleaning demand. These include innovations on the mechanical as well as on the chemical side. Specific cleaning products have been developed to support lowest cleaning process parameters (i.e. temperature, concentration) but at the same token address overall costs per cleaned part.