SMTA International Conference Proceedings


PROCESS DEVELOPMENT AND RELIABILITY EVALUATION FOR INLINE PACKAGE ON PACKAGE (POP) ASSEMBLY

Authors: Jonas Sjoberg, Todd Castello, David A. Geiger and Dongkai Shangguan, Ph.D.
Company: Flextronics International
Date Published: 10/11/2007   Conference: SMTA International


Abstract: Traditionally, most of the miniaturization for Printed Circuit Board Assemblies (PCBA) has been accomplished by stacking bare dies inside the package, reducing the pitch of the package, and/or reducing the component and pad spacing on the Printed Circuit Board (PCB). There is a limit, however, on what can be done with regards to component pitch and spacing. Package on Package stacking (PoP) offers a new alternative for further miniaturization and densification of PCBA. This paper describes the PoP process requirement, and the impact on mechanical and thermo mechanical reliability using different pad layouts and with/without underfill.

Key words: Stacking, PoP, mechanical and thermo mechanical reliability.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819