SMTA International Conference Proceedings


Author: Jeff Schake
Company: DEK USA Inc.
Date Published: 10/11/2007   Conference: SMTA International

Abstract: As the electronics assembly industry adjusts to building boards with 0201 components, the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A key objective of this work is to demonstrate assembly success using common 0201 build parameters of Type 3 solder paste and 4-mil (101.6µm) stencil thickness. Stencil artwork strategies are implemented across 27 different pad designs to determine how assembly yield is influenced by aperture area ratio, component termination overlap level in paste, and tolerance to stencil defined misregistration levels. A pad design of 9 mils wide by 11 mils long (228.6µm by 279.4µm) and separated from the opposite pad by 6 mils (152.4µm) is recommended when printed with 9 mil wide by 10 mil long (228.6µm by 254µm) apertures to achieve acceptable print quality and high assembly yield results. A direct comparison of tombstone ratios for 0201 and 01005 resistor components assembled together shows that 01005s are more stable across a variety of profile atmospheres compared to 0201s.

Keywords: 01005, metric 0402, resistor, passive, chip, tombstone, 0201

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