Surface Mount International Conference Proceedings


Author: Torsten Hauck
Company: Universitat-GH-Paderborn
Date Published: 9/10/1996   Conference: Surface Mount International

Abstract: In order to guarantee successful use, safe application and rapid development of new types of ball grid array (BGA) assemblies it becomes more and more important to directly couple knowledge regarding in-field conditions with results from computer simulations and advanced miniature experiments. Only by combined action of these three components it will eventually be-come possible to assess physical degradation in the assembly objectively. For conventionally soldered SMD components transformation rules between test and in-field conditions are still not completely known. Now, for a new type of array components the answers critically depend upon component age and change in fatigue mechanisms. Consequently, the increasing complexity of microelectronic components and the hid-den joints of BGAs will lead to an increase in reliability problems. In order to predict the time to failure for different applications several parameters relevant to fatigue of the solder ball joints need to be studied.

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