INVESTIGATION OF IMPACT RELIABILITY OF Pb-FREE SOLDER INTERCONNECTS IN BALL GRID ARRAY ASSEMBLIESAuthors: Fahad Mirza, Saurabh Athavale, Krishnan Vishwanathan, Amol Kane, Mike DiPietro, Eric Cotts, James Pitarresi, and Daryl Santos, Ph.D.
Company: Integrated Electronics Engineering Center, Binghamton University
Date Published: 10/11/2007 Conference: SMTA International
Furthermore, a comprehensive study of the effect of high temperature aging on the reliability of Pb-free assemblies in high strain rate environments is also completed. Both quantitative and qualitative comparisons between the nonaged (0 hours, fresh TVs) and aged (upto 1000 hours aging at 150°C) assemblies are presented in order to account for the product end use conditions. It was observed that aging not only lowered the impact reliability but also caused the change in the failure mechanism of the solder joint. The failure mode transitioned from pad cratering (board side) for 0 hours aged TVs to Intermetalic layer crack (IMC failure at component side joint) for 500 and 1000 hours aged TVs.
Key words: Pad cratering, impact reliability, high temperature aging
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