MITIGATING HIGH STRESS FAILURE IN A HIGH-PERFORMANCE RF/MICROWAVE MODULE ASSEMBLYAuthors: Quan Qi, Ph.D., Curt Miller, Daryl Hollis, Kathleen Ullom, Jeff McDonald, Ken Vielmette, and Heidi Davis, Ph.D.
Company: Maxtek Components Corporation
Date Published: 10/11/2007 Conference: SMTA International
While it is difficult to predict the interfacial bonding strength for dissimilar materials without resorting to calibrated test according to fracture mechanics, some experimental data may be used to infer the interfacial strength for given bonding agents. An effort to take advantage of the failure data based on different substrate sizes to predict the interfacial bonding strength is described.
Key words: RF/microwave modules, module assemblies, CTE mismatch, thermomechanical stress, reliability, thinfilm attach
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