UNIFIED FINITE ELEMENT MODEL FOR PREDICTION OF SOLDER JOINT FATIGUE UNDER THERMAL, POWER, AND VIBRATION ENVIRONMENTS FOR CERAMIC AREA ARRAY ELECTRONIC PACKAGESAuthors: Andrew Perkins and Suresh K. Sitaraman
Company: Georgia Institute of Technology
Date Published: 10/11/2007 Conference: SMTA International
Numerical Finite Element Models (FEM) have been successfully used in the past to determine solder joint reliability for a variety of environments. However, separate models are typically constructed for each loading environment due to variations in element types and capabilities of the software for each environment. Calculation and comparison of damage parameters may be inconsistent between models as mesh, boundary conditions, and element types change between models. A single FEM for all environments will enable consistent calculation of damage under each environment.
Therefore, this study aims to develop a unified FEM for predicting solder joint fatigue of a Ceramic Column Grid Array (CCGA) under thermal, power cycling, and vibration modeling. The FEM is validated against experimental data from ATC tests, power cycling tests, harmonic vibration testing, and dye-n-pry failure analysis. The developed methodology can be used for ‘what-if’ scenarios to determine fatigue life under multiple environments and look for competing design effects.
Key words: Finite Element Method, solder joint reliability, Ceramic Column Grid Array, CCGA
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