Surface Mount International Conference Proceedings


EFFECT OF SUBSTRATE CTE ON SOLDER BALL RELIABILITY OF FLIP CHIP PBGA PACKAGE ASSEMBLY

Author: Bongtae Han
Company: Clemson University
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: Thermo-mechanical behavior of a Flip Chip Plastic Ball Grid Array package assembly is characterized. High sensitivity moirti interferometry is employed to document thermal deformation of the assembly, subjected to a uniform temperature change. The results reveal that the CTE of a substrate is one of the most critical design parameters to solder ball reliability. A three-dimensional non-linear FEM analysis proceeds to quantify the effect of the substrate CTE on the solder ball strains. The maximum accumulated equivalent plastic strain per cycle is determined to assess relative reliability. For the assembly with a relatively small chip analyzed in the study, a significant improvement of solder joint reliability is predicted by optimizing the CTE of the substrate. Key Words: Flip Chip Plastic Ball Grid Array Package (FC-PBGA), Moir6 Interferometry, Coefficient of Thermal Expansion, Solder Joint Reliability



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