IMPACT OF AGING AND STORAGE CONDITIONS OF OSP PCBs ON BGA SOLDER JOINT RELIABILITYAuthors: Bala Nandagopal, Sue Teng and Mason Hu
Company: Manufacturing Technology Group - Cisco Systems, Inc.
Date Published: 10/11/2007 Conference: SMTA International
The boards were subjected to Accelerated Thermal Cycling (ATC) of -40/125 degrees C with 20 minute ramps and 10 minute dwells per IPC9701. The characteristic life (?) results indicated that all the aging periods and storage conditions had comparable reliability except for the 12 month open package storage condition which showed a significant drop in solder joint reliability. However, comparing the 1% life showed that both open and sealed packaged PCBs had similar reliability. PCBs from 3 of the 4 suppliers showed similar performance with respect to solder joint reliability, while the 4th supplier (A) consistently outperformed the rest by about 25%. The Mechanical shock testing performed at 200g and 340g with in-situ resistance and strain monitoring showed that there was no degradation in solder joint reliability due to any of the variables studied. The only failure mode observed was pad cratering on the PCB side. Overall, we may conclude that there is no degradation to the solder joint reliability for OSP PCBs stored in the sealed and open package conditions up to one year.
Key words: PCB, OSP, Shelf life, Reliability
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