SOLDERING AND SOLDER JOINT RELIABILITY FOR SELECTED SURFACE FINISHES WITH LEAD FREE SAC305 ALLOYAuthors: George Milad and Don Gudeczauskas
Company: Uyemura International Corporation
Date Published: 10/11/2007 Conference: SMTA International
It was also found that the IMC crystal lattice is dependant on solder material and the solder joint reliability is dependant on both the solder material as well as the surface finish. It was found that all four surface finishes would transition well into LF SAC 305 soldering and would produce a reliable solder joint under the experimental conditions investigated.
The surprise finding was that ENEPIG made a particularly high reliability solder joint with SAC305 as compared to the Sn37Pb. The eutectic Sn37Pb solder joint was non-uniform and uneven when formed and got progressively weaker with thermal ageing as the IMC continued to propagate.
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