AREA ARRAY CONNECTOR RELIABILITY: IMPACT OF CONVERSION TO LEAD FREE AND OF TEST VEHICLE DESIGN PARAMETERSAuthors: Heather McCormick, Alex Chan, Richard Coyle, Donald Harper, Steve Minich, Damir Jelkovic, Brent Peterman, and Mark Gray
Company: Celestica Inc., 4FCI, and Alcatel-Lucent
Date Published: 10/11/2007 Conference: SMTA International
In addition to assessing the reliability of the lead free area array connectors generally, additional testing on one of the mezzanine connectors focuses on determining the impact of changes to the test vehicle design on the connector’s reliability and failure locations. Results from the “Metro” test vehicle indicated that test vehicle design parameters may impact the reliability and/or failure mode of the mezzanine connectors. As a result, some of the testing on “Metro2” will focus on assessing the impact of changing the total stack height of the connector from 4 mm to 14 mm on the reliability of the connector, and also the impact of changing the thickness of the daughtercard from 0.062” to 0.093”. This data will assist in developing recommendations for area array test vehicle designs in an effort to standardize the reliability testing of area array mezzanine connectors.
Key words: BGA Connectors, Lead Free Assembly, Reliability
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