SMTA International Conference Proceedings


Authors: Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, and Jerry Tan
Company: Bridge Semiconductor Corporation
Date Published: 10/11/2007   Conference: SMTA International

Abstract: “Frame Level Packaging” an integrated approach to IC packaging is presented. This packaging technology aims to achieve enhanced package performance by combining the technical advantages of build up substrate, lead-frame and wafer level packages. Whilst wafer level packaging uses wafer as the processing panel, frame level packaging uses copper frame as the processing panel to build the IC packages with the existing backend infrastructure. Design flexibility and enhanced performances are achievable using the redistribution layer and array terminals residing on the fortified copper frame.

This paper describes how frame level packaging can bring about a flip chip package using a combination of gold stud bumping and gold-gold interconnect (GGI). Substrate structure and flip chip bonding results of the assembled packages are also presented.

Key words: Flip Chip, WLCSP and Lead-frame based package

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819