FRAME LEVEL PACKAGING: FLIP CHIP APPLICATIONAuthors: Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, and Jerry Tan
Company: Bridge Semiconductor Corporation
Date Published: 10/11/2007 Conference: SMTA International
This paper describes how frame level packaging can bring about a flip chip package using a combination of gold stud bumping and gold-gold interconnect (GGI). Substrate structure and flip chip bonding results of the assembled packages are also presented.
Key words: Flip Chip, WLCSP and Lead-frame based package
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