FUTURE LEAD-FREE SOLDER ALLOYS AND FLUXES – MEETING CHALLENGES OF MINIATURIZATIONAuthors: Ning-Cheng Lee, Ph.D.
Company: Indium Corporation of America
Date Published: 10/11/2007 Conference: SMTA International
Key words: solder alloys, flux, lead-free, miniaturization.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.