Surface Mount International Conference Proceedings


COST- PERFORMANCE ANALYSIS OF HIGH PIN COUNT SURFACE MOUNT PLASTIC IC PACKAGES

Author: Martin P. Goetz
Company: ASAT, Inc.
Date Published: 9/10/1996   Conference: Surface Mount International


Abstract: Surface mount packages come in various forms, most of which are industry standards. Increasing demands on electronic packaging by the semiconductor industry has led to recent developments in plastic surface mount package technology. These packages are finding applications in areas such as PCMCIA and portable products, as well as the standard desktop computer products. There is even a growing interest in plastic packaging in the defense and microwave electronics industry. Such packages include quad flat pack (QFP) type packages, both with and without internal heat slugs or heat spreaders, ball grid arrays (BGA) and thermally enhanced ball grid arrays. One of the most important industry drivers today is packaging cost. Cost can be related to a number of variables: package materials, assembly, yield, test, reliability, board yield, and performance. In comparison to earlier surface mount packages, these packages provide many improvements on these variables, yet none have proven to be perfect in all categories. In fact, the selection of the “optimal” package is usually application-specific. This paper will address the area of cost, as related to the electrical and thermal characteristics inherent to the packages and provide several figures of merit that will allow the end user to weigh the advantages of these packages under different application environments.



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