A COMPARATIVE ANALYSIS OF AQUEOUS BASED CLEANING CHEMISTRIES ON HIGH RELIABILITY ELECTRONIC ASSEMBLIESAuthor: Dale Lee
Company: Boston Scientific, Cardiac Rhythm Management
Date Published: 10/11/2007 Conference: SMTA International
In addition, the residues remaining after reflow of tin-lead and new lead-free soldering materials are proving much more difficult to remove due to increases in component density (tighter spacing), larger component packages, higher lead counts, finer lead spacing and lower component to mounting surface stand-off distances.
This paper discusses the comparative analysis of cleaning chemistry material compatibility with components, traditional FR4 based and polyimide flexible base substrates and cleaning capability of aqueous based printed circuit board cleaning processes in high reliability applications with reduced VOC emissions.
Keywords: cleaning, aqueous, lead free, Pb-free, VOC, flex
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